xTool X1 supports five laser sources, allowing users to configure the device based on different processing needs:

• 55W CO₂ laser: Standard on X1.
• 20W blue diode laser: Requires the 20W Diode Galvo Module.
• 30W fiber laser: Requires the 30W Fiber Galvo Source and the 20W Diode Galvo Module.
• 60W MOPA laser: Requires the 60W MOPA Galvo Source and the 20W Diode Galvo Module.
• 5W UV laser: Requires the 5W UV Galvo Source and the 20W Diode Galvo Module.

The five laser sources have different processing capabilities, enabling X1 to meet a variety of processing needs.

Why multiple laser sources are needed

When selecting a laser source, higher power is not always better. The first consideration is whether the laser wavelength is suitable for the material.

The same material absorbs different laser wavelengths differently. When the wavelength is suitable, the laser can be absorbed by the material to perform processes such as engraving and cutting. If the wavelength is not suitable, the laser may be reflected or transmitted through the material, making it difficult to achieve the desired processing results.

Therefore, different laser sources are needed to cover a wider range of materials and processing scenarios. The following sections introduce the five laser sources supported by X1, along with their processing capabilities and suitable applications.

55W CO₂ laser

The CO₂ laser head pre-installed on X1 delivers a 55W CO₂ laser with a wavelength of 10.6 μm, which is invisible far-infrared light.

Best suited for

• Non-metal cutting: This is where the CO₂ laser performs best. It can cut wood, MDF, acrylic, leather, paper, fabric, and rubber.
• Thick and large-format material cutting: The 55W power is sufficient for cutting thick materials and is also suitable for large-format materials.
• Acrylic cutting: The laser heats and vaporizes the material, producing smooth cut edges.
• Surface marking: It can be used for surface marking on stone, glass, and ceramic. The laser roughens the material surface, creating a whitish mark.

Processing limitations and precautions

• CO₂ laser processing is a thermal process, so cutting wood can produce charred edges.
• Bare metal reflects most of the 10.6 μm laser light, making it unsuitable for processing.

20W blue diode laser

X1 can use this laser after the 20W Diode Galvo Module is installed. Its wavelength is 450 nm, which falls within the visible blue-violet spectrum.

Best suited for

• Organic material processing: Organic materials such as wood, leather, and paper absorb this wavelength well, making them suitable for processing.
• High-speed processing: The blue diode laser is integrated into the galvo head. The galvo uses two high-speed oscillating mirrors to deflect the laser spot, enabling high-speed processing.
• Wood processing: When processing wood, it produces marks with clear contrast.

Processing limitations and precautions

• Transparent and light-colored materials absorb blue light poorly. The laser may be reflected or pass directly through the material, making these materials unsuitable for processing.

30W fiber laser

X1 can use this laser after the 30W Fiber Galvo Source and 20W Diode Galvo Module are installed. Its wavelength is 1064 nm, which falls within the near-infrared spectrum.

Best suited for

• Metal marking: This is where the laser performs best. Metals absorb this wavelength well, allowing it to create clear gray or black marks on stainless steel, aluminum, copper, and coated metals. It is suitable for making nameplates, serial numbers, logos, and similar markings. During processing, the laser does not simply “burn” the metal surface black. Instead, it causes localized micro-melting and oxidation on the surface to create the color. The resulting marks are durable, wear-resistant, and not easy to fade.
• Shallow engraving: In addition to marking, it can also be used for shallow engraving.

Processing limitations and precautions

• Due to its power limitation, it is not suitable for deep engraving or cutting metal.
• It is not suitable for processing non-metal materials.

60W MOPA laser

X1 can use this laser after the 60W MOPA galvo source and 20W Diode Galvo Module are installed. Its wavelength is also 1064 nm. Compared with a standard fiber laser, a MOPA fiber laser allows the duration of each laser pulse (pulse width) to be adjusted, providing more flexible control over how the laser interacts with the material.

Best suited for

• Color engraving on stainless steel: By controlling the heat input, the laser forms oxide layers of different thicknesses on the stainless steel surface, producing colors such as blue, gold, purple, and green.
• Black anodized aluminum marking: The laser can remove the black anodized surface layer to expose the silver-colored base material. This is suitable for surface processing on phone cases, tablet housings, and similar products, while having less impact on the base material.
• Deep and detailed metal engraving: The power is sufficient for deep engraving on metal. Adjustable laser pulse duration allows finer control over the processing depth in different areas, making it suitable for relief engraving and detailed engraving. A shorter pulse duration can also reduce heat spread to surrounding areas and minimize heat-related changes along the processing edges.

Processing limitations and precautions

• It is not suitable for processing non-metal materials.

5W UV laser

X1 can use this laser after the 5W UV galvo source and 20W Diode Galvo Module are installed. Its wavelength is 355 nm.

Although this laser has low power, its photons have extremely high energy and can directly break the chemical bonds in the material to remove it, rather than relying on heat to burn the material away. It is therefore considered a cold processing method. Very little heat is generated during processing, so charring, yellowing, or melted edges are almost entirely avoided.

Best suited for

• Heat-sensitive materials: Suitable for processing glass, crystal, ceramic, transparent or light-colored acrylic, and plastic. With other laser sources, these materials may show little visible processing effect or may crack or become blurred due to heat.
• Fine marking: The UV laser spot can reach the micrometer scale, allowing it to create fine marks. It is commonly used for detailed marking on plastic parts.

Processing limitations and precautions

• Due to its power limitation, it is not suitable for cutting or deep engraving.

At a glance

Processing area of each laser source

Click the dedicated article below to learn more:
https://support.xtool.com/article/3651

Learn more: How X1 supports five laser sources

X1 integrates multiple laser sources through the following designs while balancing processing area, speed, and stability:

• LaserSwap™ laser switching technology: Different laser sources use a modular design, allowing users to replace laser modules based on their processing needs without purchasing another device.
• Hybrid Motion™ system: The gantry handles long-range movement to cover large-format materials, while the galvo rapidly deflects the laser beam to complete detailed processing paths within a local area. Its flying-galvo four-axis system coordinates antry motion and galvo scanning to deliver high speeds across a large working area.
• UniCast Frame: Three die-cast frames replace a complex assembled structure, improving rigidity, stability, and long-term accuracy.